Technical Documentation for Solder Resist Formation for IoT Devices
Specifications such as terminal size, clearance, and solder mask thickness are listed.
In the IoT device industry, high durability that can withstand harsh environments is required. Especially for devices exposed to temperature changes, vibrations, and humidity, the reliability of printed circuit boards is a crucial factor that influences product lifespan. The proper selection and formation of solder resist are essential to protect the substrate from these external factors and ensure the long-term operation of the device. Our materials on solder resist formation technology will be helpful when selecting products. 【Usage Scenarios】 - Outdoor IoT devices - Industrial IoT equipment - IoT devices used in harsh environments 【Benefits of Implementation】 - Improved substrate protection performance - Enhanced product reliability - Assurance of long-term product lifespan
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
